I am currently working as robotics application engineer at Kawasaki Robotics. I work with customers to hash out requirements and constraints for semiconductor robots and create appropriate solutions for them. This usually involves a new end effector design and various clearance studies of the robot against the customer provided layout, with special interest in the FOUP where wafers are stored. Structural and modal FEA is done when the customer requires heavy payload to determine the effective space lost during deflection. After the design review with the customer, I finish up the 3D model and drawing and start the internal spec sheet with all the information about the new robot (what robot to reference, any major design changes, QA items, etc). After internal review with software, procurement, QnR, the spec sheet is sent to Japan as template for mass production.