An updated vacuum pad for increased vacuum surface area. The previous design had wafer slip issues due to the off-center grip.
A bellows testing jig, to separate the wet environment from the robot internals.
A mapping fiber adjustment jig. This was used during light intensity experiments to adjust the fiber depth.
Grounding shims for a rush order. Traditionally, the ESD path is transferred using a ceramic ESD coating. However, a customer needed an ESD capatible end effector much earlier than the ceramic lead time, and the only ceramic end effector available was an uncoated one.
A pivot pad end effector, used to handle warped wafers. The pivot pad height is dependent on the warp amount of the wafer and the pitch between wafers in the FOUP.
A prototype shipping block that allows for easy installation and uninstallation without robot power.
A new prototype robot link that can handle heavy payloads. Link is designed around existing harness lengths.
The bellows testing jig actuating underwater. The white strip on the shaft is moisture detection paper.
